Chip-On-Glass (COG) is a flip chip bonding method which is used for connect assembly of bare integrated circuits on glass substrate directly by using Anisotropic Conductive Film . The pitch of the IC bumps can be scaled down according to customers' requirements . This method reduces the assembly area to the highest possible packing density, which especially important to those applications that space saving is crucial. It allows a cost-effective mounting of driver chips because integrating flex PCB is no longer required. The IC is bonded directly onto the glass substrate and is suitable for handling high-speed or high-frequency signals. www.blazedisplay.com